系统构装及打线载板

SiP / Wire Bond

产品	下载	CTE Z-axis (50~260oC)	Tg @TMA	Dk@10GHz, RC50/70%	Df@10GHz, RC50/70%
EM-S526		1.3	230	3.9/3.4	0.007/0.008
EM-S370(Z)		1.8	180	4.2/3.8	0.015/0.019